闫海东

闫海东，博士/副研究员，浙江大学电气工程学院专职研究员、浙江大学杭州国际科创中心ZJU-PMIC研究员。&br;&br;研究方向：SiC/GaN/GaO功率器件新型封装方法；高性能SiC功率模块多物理场互联架构设计及可制造性；高可靠银/铜低温烧结新型互连材料、工艺集成及可靠性。&br;&br;主持和主要任务承担的省部级以上项目&br;[1] 万伏千安碳化硅模块研制，国家重点研发计划子课题，科技部，任务负责人，在研；&br;[2] 高可靠性大电流SiC功率模块研发，国家重点研发计划子课题，科技部，承担模块封装任务，在研；&br;[3] 第三代半导体高功率密度封装工艺技术与关键材料，国家高技术研究发展计划（863计划），科技部，参与，已结题；&br;[4] 碳化硅半导体芯片及其应用技术研发，浙江省重点研发计划，模块封装负责人，在研&br;[5] 车规级碳化硅器件理论与设计方法研究，浙江省自然科学基金重大项目，模块封装负责人，在研&br;[6] IGBT并联芯片集群的均流均压均温协同优化技术研究，企业项目，主持，在研；&br;[7] SiC用银焊膏制备技术研究及烧结可靠性分析，企业项目，主持，在研；&br;[8] 高性能碳化硅功率模块封装技术研究，企业项目，主持，在研&br;[9] 新能源汽车用碳化硅（SiC）MOSFET芯片产业化项，企业项目，主持，已结题&br;[10] 基于浸没式热管理系统的系能源汽车电机控制器，企业项目，主持，已结题&br;[11] 银纳米颗粒焊膏低温无压连接铜基-SiC器件的无氧烧结机理研究，国家自然科学基金，主持，已结题；&br;[12] 纳米银焊膏的甲酸辅助烧结机理与裸铜基车用碳化硅功率器件的关键封装技术研究，广西自然科学基金，主持，已结题；&br;[13] 铜-烧结纳米银-SiC器件界面的低温无氧互连方法研究，广西科技厅，主持，已结题；&br;[14] 纳米银膏封装碳化硅功率器件的关键技术研究，广西科技厅，主持，已结题；&br;&br;主要参与的省部级以上项目&br;[15] 无压低温烧结纳米银-铜连接SiC器件的高导热、长寿命封装互连方法，国家自然科学基金，参与，已结题；&br;[16] 裸铜基大功率IGBT器件的无铅烧结型界面及其服役可靠性研究，国家自然科学基金，参与，已结题；&br;[17] 结构和组织不均匀微凸点焊点在电-热-力耦合场下的蠕变行为研究，国家自然科学基金，参与，已结题；&br;[18] LED照明灯具的色漂退化机理及其可靠性建模研究，国家自然科学基金，参与，38万，参与，已结题&br;[19] 电流密度分布特征对电-热-力耦合场下微凸点焊点蠕变行为影响的研究，广西自然科学基金，参与，已结题&br;[20] 基于SIMP法功率器件散热结构优化拓扑设计开发及可靠性研究，广西科技厅，参与，已结题&br;[21] 电-热-力耦合场下非均质微凸点焊点蠕变行为和失效机制的研究，广西科技基地和人才专项，参与，已结题 论文&专利情况 [1] Jian Huang, Bi Wang, Jingjie Yuan, Xinke Wu, Haidong Yan, Qi Feng, Miao Cai, Hongbo Qin. Strengthening mechanism of electroplated Cu layer on sintered Cu joint. Journal of Materials Research and Technology, 2026, 41: 184-192. [2] Yushi Li, Chunlin Zhang, Haidong Yan, Qianjiang He, Xin Deng, Xuyang Li, Caihang Liang, Junxi Wan, Dongming Chen, Xiaokai Hua. Nano silver sintering metallurgy to realize thermoelectric interconnect for bismuth tellurides. Journal of Alloys and Compounds, 2026, 1050: 185839. [3] Yuzhi Ouyang, Junliang Lu, Haidong Yan, Sihui Hong, Zan Wu. High-Reliability and Cost-Efficient Transient Liquid Phase Bonding for Large-Area Interconnects in Power Modules. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2026, 16(2): 307-318. [4] Yang Lele, Xu Gaohui, Yan Haidong, Chen Chuantong, Su Lei. Large-area metal sinter-joining in power electronics packaging: challenges and perspectives. Journal of Materials Chemistry C, 2026. [5] Dou Xu, Su Ding, Haidong Yan, Wanli Li. Pressureless sinter-joining of copper pastes below 200 °C via multi-solvent collaborative engineering. Surfaces and Interfaces, 2025, 76: 107871. [6] Haobin Chen, Haidong Yan, Chaohui Liu, Shuai Shi, Kuang Sheng. A Novel High-Performance, High-Power Double-Sided Cooling SiC Power Module Based on Low-Temperature Pressureless Nano-Cu Sintering. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025. [7] Meiyu Wang, Haobo Zhang, Xiaona Du, Haidong Yan, Weibo Hu, Yunhui Mei. Characterization of Multiple Commercial Sintered-Silver Pastes as Die Attachment for Power Electronics Packaging: Materials, Processing, and Properties. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2025, 13(1): 892-903. [8] Lingxu Kong, Sizhe Chen, Na Ren, Manyi Ji, Yanjun Li, Haidong Yan, Kuang Sheng. High-Performance 10-kV-Rated, 175-mΩ 4H-SiC MOSFETs With MeV JFET Implantation and Efficient Termination. IEEE Transactions on Electron Devices, 2025, 72(8): 4246-4253. [9] Haobin Chen, Haidong Yan, Kuang Sheng. A Novel High-Performance Double-Sided Cooling SiC Power Module Based on Cu Sintering. In: Proceedings of the International Symposium on Power Semiconductor Devices and ICs, 2025: 461-464. [10] Meiyu Wang, Peng Gao, Yiting Han, Haidong Yan. Characterization of A Nonlinear Conductivity Encapsulant for Electric Field Reduction in High-Voltage Power Module Packaging. In: 2025 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, 2025. [11] J. Wu, Z. Wang, Y. Wei, X. Wei, H. Yan. Research on Junction Temperature Characteristics of SiC Device in Electric Drive Inverter Under CLTC-P Condition. Lecture Notes in Electrical Engineering, 2025, 1403: 68-83. [12] Yehui Meng, Haidong Yan, Maosheng Zhang. Optimization of Low Inductance and High Current Sharing for SiC Multi-Chip Power Modules Based on 3D Topological Interconnection of Cu-Clip. In: IFWS&SSLCHINA, 2025. [13] Wei Qiang Zhou, Haidong Yan, Xinke Wu, Junming Zhang. A Voltage Balancing Test Method for Power Module Based on Series-Connected SiC MOSFETs. In: 2025 Energy Conversion Congress and Expo Europe (ECCE Europe) Proceedings, 2025. [14] Jiangbin Wan, Haidong Yan, Na Ren, Qing Guo, Kuang Sheng. 3.9 kV Vertical β-Ga2O3 Hetero-Junction Diode With High-Temperature Operational Capability. In: Proceedings of the International Symposium on Power Semiconductor Devices and ICs, 2025: 361-364. [15] Meiyu Wang, Yiting Han, Haidong Yan. Advanced Packaging for High-Voltage SiC Module with Excellent Thermal, Mechanical, and Electrical Properties. In: 2025 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, 2025. [16] Haobin Chen, Haidong Yan, Chaohui Liu. A High-Performance Double-Sided Cooling SiC Power Module Packaging Design for EV Inverters. In: 2025 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, 2025. [17] Haidong Yan, Wanli Li, Yaqin Liao, Chaohui Liu. Low-Temperature Systems: Low-Temperature Sintering Technologies in Power Electronics: Materials, Process, and Advanced Packaging of SiC WBG Semiconductors. IntechOpen, 2025. [18] 李雨时, 邓馨, 胡晓凯, 闫海东, 等. 高强度烧结银的纳米晶制备和膏体研究. 电子元件与材料, 2025, 44(8): 875-881. [19] 蒙业惠, 闫海东, 成骥. 基于Cu-Clip三维拓扑互联的SiC多芯片功率模块低电感高均流优化研究. In: EVCP, 2025. [20] 陈浩斌, 闫海东, 马凯, 等. 基于源极直连策略的并联SiC MOSFETs动态均流方法. 电工技术学报, 2025, 40(16): 5119-5135. [21] 闫海东, 蒙业惠, 刘昀粲, 等. 基于低温铜烧结技术的大功率碳化硅模块电热性能表征. 电子与封装, 2025, 25(3): 82-87. [22] Zezheng Dong, Haidong Yan, Yinxiang Fan, Xinke Wu, Junming Zhang. A 3-D Integrated Power Module of GaN HEMTs Based on Silver Sintering Processes. IEEE Transactions on Power Electronics, 2024, 39(3): 2932-2937. [23] Yinxiang Fan, Haidong Yan, Junye Li, Chaohui Liu. Prefabrication and Characterization of Copper–Silver Foam Composites for Low-Temperature Interconnection of Power Modules. Journal of Electronic Materials, 2024, 53(3): 1360-1373. [24] Minghui Yun, Daoguo Yang, Miao Cai, Haidong Yan, Jiabing Yu, Mengyuan Liu, Siliang He, Guoqi Zhang. Aging and Sintered Layer Defect Detection of Discrete MOSFETs Using Frequency Domain Reflectometry Associated With Parasitic Resistance. IEEE Transactions on Device and Materials Reliability, 2024, 24(1): 129-141. [25] Wanli Li, Yitian Li, Lingying Li, Haidong Yan, Takeo Minari. Printing flexible Cu–Ni traces with high conductivity and high thermal stability by in-situ formed multiscale core–shell structures in inks. Applied Surface Science, 2024, 646: 158967. [26] Bifu Xiong, Jinguo Ge, Quantong Li, Chuan Hu, Haidong Yan, Yu-An Shen. Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere. Soldering and Surface Mount Technology, 2024, 36(1): 39-50. [27] Meiyu Wang, Peng Gao, Haidong Yan, Yunhui Mei. Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14(9): 1537-1550. [28] Yujian Wang, Dou Xu, Haidong Yan, Wanli Li, et al. Low-temperature copper sinter-joining technology for power electronics packaging: A review. Journal of Materials Processing Technology, 2024, 332: 118526. [29] Zezheng Dong, Jinxu Yang, Yinxiang Fan, Haidong Yan, Xinke Wu. A Gallium Nitride Integrated Power Module with Ultra-low Parasitic Inductances and Thermal Resistance. In: Conference Proceedings IEEE Applied Power Electronics Conference and Exposition (APEC), 2024: 175-180. [30] Yabo Zhao, Yakun Zhang, Chaohui Liu, Haidong Yan, Xiao-Lu Yan, Daoguo Yang. Packaging Evaluations of SiC MOSFETs Based on Cu-Clip Interconnection Architecture. In: 2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024. [31] Meiyu Wang, Haobo Zhang, Haidong Yan, et al. Characterization and Mechanism of Sintered-Silver Die-Attach on Electroless Nickel Surface Finish with Different Phosphorus Content. In: 2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024. [32] Yao Zhu, Haidong Yan, Xiao-Lu Yan, Yakun Zhang, Wangyun Li, Chaohui Liu. Low-Temperature Pressureless Copper Sintering under Formic Acid Atmosphere. In: 2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024. [33] Wanli Li, Yitian Li, Yujian Wang, Jie Zhang, Haidong Yan. Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering. Journal of Materials Processing Technology, 2023, 322: 118207. [34] Zezheng Dong, Yinxiang Fan, Haidong Yan, Xinke Wu. A GaN HEMT Integrated Power Module with Silver Sintering Processes. In: PEAS 2023 - 2023 IEEE 2nd International Power Electronics and Application Symposium Conference Proceedings, 2023: 843-848. [35] Yitian Li, Yujian Wang, Haidong Yan, Wanli Li, Jie Zhang, He Zhang. Enhancing Properties of Low-temperature Pressureless Ag Sinter-joining by Optimizing Solvents and Hybrid Particles. In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023. [36] Yinxiang Fan, Haidong Yan, Wangyun Li, Yakun Zhang, et al. Design and Integration Approach of Low-Inductance Vertical Interconnection Structure for Gallium-Nitride High Electron Mobility Transistors. In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023. [37] Yuncan Liu, Haidong Yan, Wangyun Li, Yakun Zhang, et al. A Wire-less SiC Power Module Using Flip-Chip Sintering Method. In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023. [38] 吴军科, 李辉, 魏云鹏, 闫海东, 等. SiC MOSFET的温度特性及结温评估研究进展. 半导体技术, 2023, 48(7): 541-556. [39] Yubing Gong, Longgen Liu, Siliang He, Haidong Yan, Hongbo Qin. Shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu joints with same solder volume and different heights at increasing current density. Journal of Materials Science: Materials in Electronics, 2022, 33(32): 24906-24919. [40] Peijie Liang, Zhiliang Pan, Haidong Yan. Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer. Materials, 2022, 15(6): 2232. [41] 闫海东, 吴义伯, 杨道国. 宽禁带半导体器件耐高温连接材料、工艺及可靠性. 北京: 机械工业出版社, 2022. [42] Hui Li, Junke Wu, Yunpeng Wei, Haidong Yan. Smooth control of low-frequency junction temperature fluctuation for SiC MOSFET based on combined regulation methods. In: MEMAT 2022 - 2nd International Conference on Mechanical Engineering, Intelligent Manufacturing and Automation Technology, 2022: 829-834. [43] Xin Deng, Haidong Yan, Xilin Huang, et al. Heterogeneous Bonding with Nanostructured Silver Langmuir-Blodgett Film. In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022. [44] Guoping Lv, Haidong Yan, Daoguo Yang, Chaohui Liu, Guoqi Zhang, et al. Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint. In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022. [45] Haidong Yan, Yun-Hui Mei, Guo-Quan Lu. Pressureless sintering multi-scale Ag paste by a commercial vacuum reflowing furnace for massive production of power modules. Journal of Materials Science: Materials in Electronics, 2019, 30(10): 9634-9641. [46] Miao Cai, Yonghu Liang, Minghui Yun, Xuan-You Chen, Haidong Yan, Guoqi Zhang. Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs. IEEE Access, 2019, 7: 27106-27114. [47] Yan Haidong, Liang Peijie, Mei Yunhui, Feng Zhihong. Brief review of silver sinter-bonding processing for packaging high-temperature power devices. Chinese Journal of Electrical Engineering, 2020, 6(3): 25-34. [48] Peijie Liang, Haidong Yan, Daoguo Yang, Wangyun Li. Void Eliminating Process of Sintered-Silver Die Attachment in Anaerobic-Sintering Atmospheres. In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020. [49] Xing-Min Li, Jun Gui, Wang-Yun Li, Hai-Dong Yan, Dao-Guo Yang, et al. Tensile performance of line-type microscale Cu/Sn-58Bi/Cu joints under electro-thermo-mechanical coupled loads. In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020. [50] Jun Gui, Xing-Min Li, Wang-Yun Li, Hai-Dong Yan, Dao-Guo Yang. Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints after deep cryogenic treatment with different time. In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020. [51] 闫海东, 梁陪阶, 梅云辉, 等. 无压低温烧结纳米银封装电力电子器件的进展与思考. 电源学报, 2020, 18(4): 15-23. [52] Haidong Yan, Yun-Hui Mei, Xin Li, Changsheng Ma, Guo-Quan Lu. A Multichip Phase-Leg IGBT Module Using Nanosilver Paste by Pressureless Sintering in Formic Acid Atmosphere. IEEE Transactions on Electron Devices, 2018, 65(10): 4499-4505. [53] Haidong Yan, Weyong Ma, Yunhui Mei, Daoguo Yang. An online-sintering approach for bonding high-power devices using nanosilver paste. In: Proceedings 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018: 260-264. [54] Dongjing Liu, Yasong Fan, Haidong Yan, D.G. Yang, et al. Preparation and Thermal Analysis of the nano-silver/Graphene composite material for packaging module. In: Proceedings 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018: 924-927. [55] Ping Zhang, Xiong Jiang, Peng Yuan, Haidong Yan, Daoguo Yang. Silver nanopaste: Synthesis, reinforcements and application. International Journal of Heat and Mass Transfer, 2018, 127: 1048-1069. [56] Yunhui Mei, Lin Li, Haidong Yan, Yijing Xie, et al. Electric-current-assisted sintering of nanosilver paste for copper bonding. Journal of Materials Science: Materials in Electronics, 2017, 28(12): 9155-9166. [57] Haidong Yan, Yunhui Mei, Xin Li, Gang Chen, Guo-Quan Lu. A phase-leg IGBT module using DBC substrate without Ag finish by pressureless sintering of nanosilver paste. In: Conference Proceedings IEEE Applied Power Electronics Conference and Exposition (APEC), 2017: 3013-3020. [58] Haidong Yan, Yunhui Mei, Xin Li, Hailong Li, Guo-Quan Lu. Effect of as-printed bondline thickness on assembling high power laser diodes by sintering of nanosilver paste. In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016: 845-848. [59] Haidong Yan, Shancan Fu, Yunhui Mei. Double-sided joining IGBT devices by pressureless sintering of nanosilver paste. In: 2016 International Conference on Electronics Packaging (ICEP), 2016: 386-390. [60] Haidong Yan, Yunhui Mei, Xin Li, Pu Zhang, Guo-Quan Lu. Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions. Microelectronics Reliability, 2015, 55(12): 2532-2541. 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