科研之友
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摘要
The method for lumped-parameter via crosstalk ( LPVC) model development is proposed in this letter. Good agreement between the full-wave modeling and the physics-based via simulation has been achieved in frequency-domain. This model is easier to construct and allows researchers to better understand the impact of each parameter on crosstalk between via than former models. Analysis results show that, both power/ground ( P/G) geometry and via distance have significant influences on crosstalk between vias on high-speed printed circuit board ( PCB).
- 出版日期2016-9
- 单位东南大学
