摘要
The requirements for using carbon nanotubes as vias and interconnects are described. The growth of high density forests of vertically-aligned carbon nanotubes for interconnect applications by chemical vapor deposition is described. Densities up to 1.4 x 10(13) cm(-2) have been achieved by maintaining a small nanotube diameter. The process integration devices is reviewed.
- 出版日期2012-1