A Broadband Microstrip-to-Microstrip Vertical Via Interconnection for Low Temperature Co-Fired Ceramic Applications

作者：Liu, Yupeng^*; Xia, Lei; Xu, Ruimin

来源：Applied Computational Electromagnetics Society Journal, 2017, 32(12): 1156-1159.

• Equivalent model
• low temperature co-fired ceramic
• microstrip-to-microstrip and vertical via interconnect
• microwave

This letter presents a microstrip-to-microstrip vertical via interconnect in microwave low temperature co-fired ceramic (LTCC) technology. According to the simulation results, the insertion loss is less than 0.33 dB and the return loss is greater than 29.9 dB from 0.3 GHz to 18 GHz. An equivalent lumped model is developed for analyzing the microstrip-to-microstrip vertical interconnection. The structure has been manufactured and measured.

• 出版日期2017-12
• 单位电子科技大学