Antireflective Hydrophobic Si Subwavelength Structures Using Thermally Dewetted Ni/SiO2 Nanomask Patterns

作者：Joo Dong Hyuk; Leem Jung Woo; Yu Jae Su^*

来源：Journal of Nanoscience and Nanotechnology, 2011, 11(11): 10130-10135.

DOI：10.1166/jnn.2011.5000

• Disordered Subwavelength Structures
• Antireflective Characteristics
• Hydrophobic Surface
• Thermal Dewetting
• Nickel Nanoparticles
• Inductively Coupled Plasma Etching

We report the disordered silicon (Si) subwavelength structures (SWSs), which are fabricated with the use of inductively coupled plasma (ICP) etching in SiCl4 gas using nickel/silicon dioxide (Ni/SiO2) nanopattens as the etch mask, on Si substrates by varying the etching parameters for broadband antireflective and self-cleaning surfaces. For the fabricated Si SWSs, the antireflection characteristics are experimentally investigated and a theoretical analysis is made based on the rigorous coupled-wave analysis method. The desirable dot-like Ni nanoparticles on SiO2/Si substrates are formed by the thermal dewetting process of Ni films at 900 degrees C. The truncated cone shaped Si SWS with a high average height of 790 +/- 23 nm, which is fabricated by ICP etching with 5 sccm SiCl4 at 50 W RF power with additional 200 W ICP power under 10 mTorr process pressure, exhibits a low average reflectance of similar to 5% over a wide wavelength range of 450-1050 nm. The water contact angle of 110 degrees is obtained, indicating a hydrophobic surface. The calculated reflectance results are also reasonably consistent with the experimental data.

• 出版日期2011-11