Anisotropy of Wetting and Spreading in Binary Cu-Pb Metallic System: Experimental Facts and MD Modeling

作者：Timoshenko Vadim^*; Bochenkov Vladimir; Traskine Vladimir; Protsenko Pavel

来源：Journal of Materials Engineering and Performance, 2012, 21(5): 575-584.

DOI：10.1007/s11665-012-0184-5

• anisotropy
• contact angle
• copper
• lead
• spreading

Contact angle for millimeter-size drops of lead on {100} and {110} surfaces of monocrystalline copper and on polycrystalline copper was determined by means of dispensed drop technique at 450 A degrees C under He-H-2 atmosphere. It was demonstrated that the wetting anisotropy (a difference between contact angles on differently oriented substrates) is not exceed a few degrees. Spreading kinetics was found to be different for the first and second drops deposited on each substrate. This result was interpreted as an effect of a lead precursor film formation on the substrate surface. Molecular dynamics simulations of the lead drop spreading over {111}, {100}, and {110} surfaces of monocrystalline copper confirm the weak anisotropy of equilibrium contact angle and a formation of lead precursor film on copper surface in front of wetting line.

• 出版日期2012-5