An Easy Way to Quantify the Adhesion Energy of Nanostructured Cu/X (X = Cr, Ta, Mo, Nb, Zr) Multilayer Films Adherent to Polyimide Substrates

作者：Wu, Kai; Zhang, Jin-Yu; Liu, Gang^*; Li, Jiao; Zhang, Guo-Jun; Sun, Jun^*

来源：Acta Metallurgica Sinica (English Letters), 2016, 29(2): 181-187.

DOI：10.1007/s40195-016-0375-4

• Uniaxial tensile testing
• Nanostructured multilayer films
• Flexible substrates
• Buckling behaviors
• Adhesion energy

An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quantitatively estimate the interfacial energy of the nanostructured multilayer films (NMFs) adherent to flexible substrates. The interfacial energies of polyimide-supported NMFs are determined to be similar to 5.0 J/m(2) for Cu/Cr, similar to 4.1 7/m(2) for Cu/Ta, similar to 2.8 J/m(2) for Cu/Mo, similar to 1.1 J/m(2) for Cu/Nb, and similar to 1.2 J/m(2) for Cu/Zr NMFs. Furthermore, a linear relationship between the adhesion energy and the interfacial shear strength is clearly demonstrated for the Cu-based NMFs, which is highly indicative of the applicability and reliability of the modified models.

• 出版日期2016-2
• 单位西安理工大学; 西安交通大学