Au-Sn SLID Bonding-Properties and Possibilities

作者：Tollefsen Torleif A^*; Larsson Andreas; Lovvik Ole Martin; Aasmundtveit Knut

来源：Metallurgical and Materials Transactions B-Process Metallurgy and Materials Processing Science, 2012, 43(2): 397-405.

DOI：10.1007/s11663-011-9609-z

Au-Sn solid-liquid interdiffusion (SLID) bonding is a novel and promising interconnect technology for high-temperature applications. This article gives a review over previously published work on Au-Sn SLID bonding. An overview of the crystal phases and the thermomechanical properties of the Au-Sn phases relevant for Au-Sn SLID bonding is given. A summary of the bonding conditions used during Au-Sn SLID bonding is presented together with results from reliability tests. Additional challenges, possibilities, and recommendations for how a reliable high-temperature Au-Sn SLID bonding should be constructed are also discussed.

• 出版日期2012-4