科研之友
微信
新浪微博
Facebook
分享链接
摘要
3D molded interconnect device (3D-MID) is a kind of injection-molded thermoplastic part with integrated electronic circuit traces. Currently, it is a hotspot of the electronic and telecommunication equipment industry. Laser direct structuring (LDS) is the main approach to fabricate 3D-MID. Laser scans and activates the surface of thermoplastic parts. After plating, the activated area is coated with copper. In this study, a model was built to describe the mechanisms of interaction between a substrate and laser. The nanosecond laser was applied in the LDS process to manufacture 3D circuit on 3D-MID. With the aid of variable laser pulse width, the model was confirmed by a series of experiments including investigations of roughness, surface structure and energy spectrum. Finally, critical factors affecting the LDS process were found out. They are effective guides for many LDS applications.
- 出版日期2016-11
- 单位北京工业大学
