Microstructural studies of W-10 wt.% Cu composites prepared by using ultrafine composite powder

作者：Sun, Benzhe; Song, Jiupeng; Yu, Yang; Zhuang, Zhigang; Niu, Mingjie; Liu, Yan; Zhang, Tinghui; Qi, Yang^*

来源：International Journal of Refractory Metals and Hard Materials, 2014, 45: 76-79.

DOI：10.1016/j.ijrmhm.2014.04.005

• Tungsten-copper composites
• Ultrafine composite powder
• Grain size
• Orientation relationship
• Residual stress

Tungsten-copper (W-Cu) composites containing 10 wt.% Cu (W-10Cu) were prepared by pressing and sintering a type of ultrafine composite powder. Constituent phases, grain size and orientation relationship between Wand Cu grains were characterized and investigated. The results show that W-10Cu composites are composed of W and Cu elementary substance and orientation relationship between W and Cu grains is defined as [(11) over bar 4](cu)//[0(1) over bar 1](w) and (131)(cu)//(200)(w). The existence of the orientation relationship depends largely on the two factors. First, the grain sizes of both W and Cu were in the nanoscale range. Secondly, the interplanar spacing between both phases can match well owing to the residual stress of the W/Cu interface. Consequently, the obtained composites exhibited high density and excellent thermal conductivity.

• 出版日期2014-7
• 单位东北大学