An analytical dislocation multiple-pile-up model for the yield stress of fully lamellar TiAl alloys

作者：Yang J^*; Hu GK; Zhang YG; Su JL

来源：Modelling and Simulation in Materials Science and Engineering, 2003, 11(4): 627-634.

DOI：10.1088/0965-0393/11/4/313

An analytical dislocation multiple-pile-up model is proposed to relate the yield stress of lamellar materials to lamellar thickness, d(LM), and grain size, d(GB). A simple analytical formula is derived, which gives a good correlation with the experimental results for relatively thick lamellae.

• 出版日期2003-7
• 单位北京航空航天大学