摘要

Ablation and spallation of gold thin films by an ultrashort laser pulse are simulated by using an integrated two-temperature model and molecular dynamics method with inclusion of the hot electron blast force. The simulation results show that the ultrafast laser-induced nonthermal ablation and spallation both are essentially due to dynamic tensile stress that exceeds the local material strength. It is also demonstrated that a simultaneous use of femtosecond and picosecond laser pulses could induce spallation without causing undesired front-side damage to the film. This may be suited to peel an ultrathin film (1 mu m in thickness or less) from its substrate or to improve the material removal rate of precise laser processing.