A research on stress and demolding temperature during hot embossing process of microlens array

作者：Wang Yiqing^*; Zhang Qing; Gan Daiwei; Kuang Xinbin; Ding Yucheng; Chen Feng; Liu Hongzhong

来源：Journal of Xi'an Jiaotong University, 2013, 47(4): 6-10.

DOI：10.7652/xjtuxb201304002

• Hexagonal micro-lens arrays
• Hot embossing process
• Hot-embossing
• Large-scale manufacturing
• Manufacturing process
• Micro-lens arrays
• Temperature decrease
• Temperature drops

The embossing stress and demolding temperature in the manufacturing process of the gapless hexagonal microlens array by hot embossing process are studied for large-scale manufacturing. The stress change of polymethylmethacrylate (PMMA) in the gapless hexagonal microlens array embossing process is simulated by finite element method. Influencing factors of adhesion strength between mold and PMMA are analyzed. The analysis results show that the normal stress decreases and reaches the lowest level at last when the demolding temperature reduces. The adhesion strength declines as the demolding temperature decreases. When the demolding temperature drops to 20°C, the height fidelity of embossing specimen reaches 94.7%, and embossing defects are eliminated in a large scale.

• 出版日期2013