Negative thermal expansion, electrical and mechanical properties of antiperovskite Mn3Zn0.5A0.5N (A = Sn, Ag, Ni)

作者：Yan, X.^*; Miao, J.; Liu, J.; Wu, X.; Zou, H.; Sha, D.; Cheng, X.

来源：Advances in Applied Ceramics, 2016, 115(7): 422-426.

DOI：10.1080/17436753.2016.1172412

• Nitrides
• Sintering
• Thermal expansion
• Electrical conductivity

Thermal expansion, electrical conductivity, hardness and friction property of Mn3ZnN, which had been doped with Sn, Ag or Ni and sintered at 1223 K, were measured. X-ray diffraction analyses show that these compounds have a cubic antiperovskite Mn3CuN-type structure and negative thermal expansion (NTE). The width of NTE operation temperature (Delta T) and the coefficient of thermal expansion are different when Mn3ZnN was doped with different element. A giant NTE coefficient of -81.00 x 10(-6) K-1 is obtained from Mn3Zn0.5Ag0.5N while Delta T is 18 K. A broad Delta T of 60 K is obtained from Mn3Zn0.5Sn0.5N with thermal expansion coefficient of -19.05 x 10(-6) K-1. The results show that Mn(3)Zn(0.5)A(0.5)N (A = Sn, Ag, Ni) has good electrical conductivity. The electrical conductivity of Mn3Zn0.5Ag0.5N is the largest among these compounds as 2.45 x 10(3) S cm(-1). The Vickers hardness of these compounds is more than 350 HV. The friction coefficients of Mn3Zn0.5Ag0.5N, Mn3Zn0.5Ni0.5N and Mn3Zn0.5Sn0.5N are 0.5318, 0.4554 and 0.2336, respectively.

• 出版日期2016
• 单位江苏大学