Diffusion induced isothermal solidification during transient liquid phase bonding of cast IN718 superalloy

作者：Pouranvari M^*; Ekrami A; Kokabi A H

来源：Canadian Metallurgical Quarterly, 2014, 53(1): 38-46.

DOI：10.1179/1879139513Y.0000000076

• Transient liquid phase bonding
• Isothermal solidification
• Superalloy
• IN718

In transient liquid phase (TLP) bonding for commercial applications, one of the important key parameters is the holding time required for complete isothermal solidification t(IS), which is a prerequisite for obtaining a proper bond microstructure. The objective of the study is to analyse the isothermal solidification kinetics during TLP bonding of cast IN718 nickel based superalloy. Experiments for TLP bonding were carried out using a Ni-7Cr-4.5Si-3Fe-3.2B (wt-%) amorphous interlayer at several bonding temperatures (1273-1373 K). The time required to obtain TLP joints free from centreline eutectic microconstituents was experimentally determined. Considering the solidification behaviour of residual liquid, tIS could be predicted by a mathematical solution of the time dependent diffusion equation based on Fick's second law.

• 出版日期2014-1