Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests

作者：Wang, Jau Sheng; Tsai, Chun Chin; Liou, Jyun Sian; Cheng, Wei Chih; Huang, Shun Yuan; Chang, Gi Hung; Cheng, Wood Hi

来源：Microelectronics Reliability, 2012, 52(5): 813-817.

DOI：10.1016/j.microrel.2011.07.057

The mean-time-to-failure (MITE) evaluation of encapsulation materials of LED package in accelerated thermal tests is presented. The Weibull and Arrhenius theory was used to characterize the thermal degradations of encapsulation materials for LED package in a quantitative investigation. The shape parameter, scale parameter, MITT and activation energy (E-a) could be obtained to potentially provide clear values for comparison and understanding. The results showed that the glass as encapsulation material of LED modules exhibited better thermal stability than the silicone encapsulation by about 7 times in lumen loss, 2 times in chromaticity shift, and 3 times in correlated color temperature at 150 degrees C. Furthermore, an order magnitude MTTF improvement at room temperature was achieved in the glass encapsulation case.

• 出版日期2012-5
• 单位中山大学; 中国人民解放军海军大连舰艇学院