Atomic diffusion features in Au/Al & Al/Ni bonding interface

作者：Li Jun Hui^*; Min Si Zong; Duan Jian; Han Lei; Zhong Jue

来源：Defect and Diffusion Forum, 2005, 247-248: 29-36.

• Atomic diffusion
• Bonded strength
• Dimples
• Thermosonic bonds

Vertical section features in bonding point were produced by ion-sputter thinning, and were tested by using TEM-F30. Lift-off characteristics at the interface of Ultrasonic bond are observed by using SEM (JSM-6360LV). Results show that thickness of Au/Al atomic diffusion interface was about 500 Nanometer under ultrasonic and thermal energy. Ultrasonic vibration activates dislocations at metal crystal lattice. Fracture morphology of lift-off interface was dimples. Tensile fracture appeared by pull-test not in bonded interface but in basis material, and bonded strength at interface was enhanced by diffused atom from the other side.

• 出版日期2005
• 单位中南大学