科研之友
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摘要
An analytical solution for detuning effect of CPW with cap wafer by applying the conformal mapping method is presented in the paper. A wafer level packaging structure for RF MEMS devices is optimized with the developed analytical formulas. The cavity depth of 40 mu m is adequate to reduce the detuning of the MEMS circuit to an acceptable level for the 50 Omega CPW on the glass substrate for the glass cap wafer.
- 出版日期2009
- 单位清华大学
