摘要

This study investigated the impact of different light curing units ( LCUs) for the polymerization of adhesive system visio.link ( VL) on the tensile bond strength ( TBS) of different PEEK compositions. For TBS measurements, 216 PEEK specimens with varying amounts of TiO2 ( PEEK/0%, PEEK/20%, PEEK/>30%) were embedded, polished, air abraded ( Al2O3, 50 mu m, 0.4 MPa), conditioned using VL, and polymerized using either a halogen LCU ( HAL-LCU) or a LED LCU ( LED-LCU) for chairside or labside application, respectively. After thermocycling ( 5000x, 5/55 degrees C), TBS was measured, and fracture types were determined. Data was analyzed using a 2-way ANOVA followed by Tukey-HSD, Kruskal-Wallis H and Mann-Whitney U tests as well as a Chi(2)-test and a Ciba-Geigy table ( p < 0.05). Globally, the light curing units, followed by PEEK composition, was shown to have the highest impact on TBS. The HAL-LCUs, compared to the LED-LCUs, resulted in a higher TBS for all PEEK compositions-without significant differences between chairside and labside units. Regarding the different PEEK compositions, PEEK/20%, compared to PEEK/0%, resulted in a higher TBS when both, HAL-LCUs or LED-LCUs were used for labside application. In comparison with PEEK/>30%, PEEK/ 20% resulted in a higher TBS after using HAL-LCU for labside application. No significant differences were found between PEEK/0% and PEEK/>30%. HAL-LCU with PEEK/20% for labside application showed a higher TBS than HAL-LCU with PEEK/20% for chairside application, whereas LED-LCU with PEEK/>30% for chairside application showed a higher TBS than LED-LCU with PEEK/>30% for labside application.

  • 出版日期2017-1