科研之友
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摘要
Flip-chip joining using anisotropic conductive adhesive (ACA) has many advantages. But the reliability of ACA interconnection is still a concern issue. There are many studies about the reliability, but little work was done about the bonding process's effect. It is a coupled field problem which needs multi-physics simulation. In order to improve the reliability of the packaging, a parameters optimization method based on multi-physics simulation was developed. A response surface method was used to reduce the computational cost. A generic model was built as an illustration.
- 出版日期2008
- 单位数字制造装备与技术国家重点实验室; 华中科技大学
