摘要

In this Note, infrared image sequences of a SiCf/SiC composite excited with a uniform heat pulse are processed using a modal approach. A new analytical integral transform (called analytical SVD or ASVD) inspired by the classical Singular Value Decomposition is developed and implemented on the raw experimental data. The second resulting spatial mode (out of a thousand) yielded by the ASVD provides, without further processing, a 2D mapping of the normalized local transverse diffusivity variations around a nominal value. Such mapping yields information on the inner structure of the material, and can be used to reveal the presence of voids inside the medium. This method is thus implemented on a tensile testing machine, to detect microcracks in a SiCf/SiC composite sample under mechanical stress in almost real time.

  • 出版日期2008-5

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