An analytical solution for the morphological evolution of a hole in the interconnect embedded in matrix

作者：Li, S.; Wang, X.^*; Wang, H.; Li, Z.

来源：Composites Part B: Engineering , 2010, 41(8): 608-612.

DOI：10.1016/j.compositesb.2010.09.008

• Thin films
• Defects
• Microstructures
• Analytical modeling

An orthotropic model for the morphological evolution of a hole in representative interconnection lines embedded in a matrix with different line aspect (volume) ratio, under mechanical loadings, is established. The thermodynamics potential of the morphological evolution of a hole in the orthotropic model is given based on energy principle. Thus, the path and the bifurcation condition of the morphological evolution of the hole in the orthotropic model are described, which gives some insight into the reliability of the representative interconnect embedded in a matrix under mechanical loading.

• 出版日期2010-12
• 单位海洋工程国家重点实验室; 上海交通大学