科研之友
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摘要
System on package (SoP) has been widely spreading to the electronic devices due to its low fabrication cost, fast time to market, and high performance. For the system on package applications, embedded system and its materials should be considered. In this study, SrTiO3 was chosen to the starting material due to its excellent dielectric properties such as high dielectric permittivity around 300 and low loss tangent around 5 x 10-4 at 295 K. Voltage dependent leakage currents have been carried out in the temperature range of 303 K363 K. As the epoxy additives were increased, leakage current of SrTiO3-epoxy thick film was increased. In our experiments, SrTiO3-epoxy composite thick film showed the negative coefficient temperature of resistivity properties. The resistivity was calculated by considering its geometry. In this paper, the activation energy of SrTiO3-epoxy composite thick films was investigated by employing the Arrhenius equation. From the Arrhenius plot, we observed the two types of conduction of SrTiO3-epoxy composite thick films.
- 出版日期2010
