A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing

作者：Huang Yi Ren; Kuo Sheng An; Stach Michal; Liu Chia Hsing; Liao Kuan Hsun; Lo Cheng Yao^*

来源：Sensors, 2012, 12(4): 4172-4186.

DOI：10.3390/s120404172

• curvature sensor
• flexible electronics
• inkjet printing

A process combining conventional photolithography and a novel inkjet printing method for the manufacture of high sensitivity three-dimensional-shape (3DS) sensing patches was proposed and demonstrated. The supporting curvature ranges from 1.41 to 6.24 x 10(-2) mm(-1) and the sensing patch has a thickness of less than 130 mu m and 20 x 20 mm(2) dimensions. A complete finite element method (FEM) model with simulation results was calculated and performed based on the buckling of columns and the deflection equation. The results show high compatibility of the drop-on-demand (DOD) inkjet printing with photolithography and the interferometer design also supports bi-directional detection of deformation. The 3DS sensing patch can be operated remotely without any power consumption. It provides a novel and alternative option compared with other optical curvature sensors.

• 出版日期2012-4
• 单位清华大学