Diffusion annealing of copper-silver bimetallic strips at different temperatures

作者：Meng L^*; Zhou SP; Yang FT; Shen QJ; Liu MS

来源：Materials Characterization, 2001, 47(3-4): 269-274.

DOI：10.1016/S1044-5803(01)00182-6

• Cu-Ag bimetallic strip
• diffusion annealing
• interface
• bonding property
• microstructure

Copper-silver bimetallic strips prepared by cold roll cladding have been treated by diffusion annealing in the temperature range 250-800 degreesC. The interface bonding level and the hardness of the matrix copper and silver have been determined and the microstructure in the interface region has been observed. The interface bonding level is particularly enhanced by annealing at 400 and 800 degreesC. High diffusion anneal temperatures lead to reductions in the strip hardness values. Recrystallization could just be detected in the strips annealed at 250 degreesC but were much more manifest at 400 degreesC. Annealing above 600 degreesC produces fine-grained areas between the interface and the silver matrix. Diffusion anneal treatments that can induce recovery, recrystallization, or partial fusion at the bonding interface can lead to enhancement of the interface bonding level.

• 出版日期2001-10
• 单位浙江大学