摘要

This investigation adopts the concept of grey whitening functions in control charts to generate a new grey whitening functions control chart. These new control charts are then applied to monitoring process monitor Wafer Back Grinding. The grey whitening functions are incorporated in the control charts, thus simplifying the calculation and improving the practical interoperability. In addition to providing a valuable reference for efforts to monitor process management performance and avoid adverse rework unnecessary reworking and additional production costs.

  • 出版日期2012