Application of electroless Ni-Zn-P film for under-bump metallization on solder joint

作者：Tai F C; Wang K J; Duh J G^*

来源：Scripta Materialia, 2009, 61(7): 748-751.

DOI：10.1016/j.scriptamat.2009.06.024

• Ni-Zn-P film
• X-ray diffraction
• Thermal stability
• (Ni,Cu)(3)Sn(4) IMC

A ternary Ni-8Zn-8P film was fabricated with alkaline chemical Solution by an electroless method, the annealed Ni-8Zn-8P film exhibiting better thermal stability, In the case of the Sn-3Ag-0.5Cu/Ni-8Zn-8P joint, the (Ni,Cu)(3)Sn(4) intermetallic compound can attach well to the Ni-8Zn-8P film after reflow. The line profile of the Zn element showed that the Zn was only distributed within the Ni-8Zn-8P film, indicating that Zn cannot be used as the diffusion barrier for Ni-diffusion to form (Ni,Cu)(3)Sn(4) IMC, in which no Zn was traced.

• 出版日期2009-10
• 单位清华大学