科研之友
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摘要
Hot embossing an open-die process with a flat mold has limited capabilities in embossing thick films with high-aspect-ratio microstructures. The process suffers from a small process window due to a coupled control scheme for both embossing pressure and embossing thickness. To enlarge the process window, the standard flat mold was modified to include a circumferential landing area, with which the embossing pressure can be separately controlled. Theoretical analyses were carried out to understand the cause of the small process window in hot embossing and the benefits from the new tool design. A case study involving a disk with a centered high-aspect-ratio feature was performed. The analysis showed that, in the new process, the filling aspect ratio is not limited and uniform embossing pressure can be attained on the entire embossing disk. Experiments were conducted to partly verify the analytical findings. With the simple and yet useful tool modification, thick and discrete parts with high-aspect-ratio surface features were successfully embossed in a single-step operation.
- 出版日期2008-4
