Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal

作者：Chang S Y^*; Chuang T H; Tsao L C; Yang C L; Yang Z S

来源：Journal of Materials Processing Technology, 2008, 202(1-3): 22-26.

DOI：10.1016/j.jmatprotec.2007.08.045

• active soldering
• ZnS-SiO2
• copper
• Sn3.5Ag4Ti(Ce Ga)

An Sn3.5Ag4Ti(Ce, Ga) active solder is used for joining ZnS-SiO2 ceramic sputtering targets with copper backing plates at 250 degrees C in air. Direct soldering using the Sn3.5Ag4Ti(Ce, Ga) metal filler has been found to be a reliable and simple technique for ZnS-SiO2 ceramic,bonding with ZnS-SiO2 and copper. The shear strengths for ZnS-SiO2/ZnS-SiO2 and ZnS-SiO2/Cu joints are 6.5 and 5.2 MPa, respectively The bonding mechanism is described, with emphasis placed on the action of a rare earth element (Ce) and the active metal reaction. The interfacial reaction between Sn3.5Ag4Ti(Ce, Ga) filler metal and copper at temperatures ranging from 120 to 200 degrees C is conducted and discussed.

• 出版日期2008-6-20