A novel cleaner for colloidal silica abrasive removal in post-Cu CMP cleaning

作者：Deng Haiwen; Tan Baimei; Gao Baohong; Wang Chenwei; Gu Zhangbing; Zhang Yan; Institute of Microelectronics Hebei University of Technology

来源：Chinese Journal of Semiconductors, 2015, 36(10): 163-167.

DOI：10.1088/1674-4926/36/10/106002

• colloidal silica abrasives removal
• FA/O alkaline cleaner
• non-ionic surfactant
• surface roughness

A novel cleaning solution,named FA/O alkaline cleaner,was proposed and demonstrated in the removal of colloidal silica abrasives.In order to remove both the chemical and physical absorbed colloidal silica abrasives,an FA/OII chelating agent and non-ionic surfactant were added into the cleaner.By varying the concentration of chelating agent and non-ionic surfactant,a series of experiments were performed to determine the best cleaning results.This paper discusses the mechanism of the removal of colloidal silica abrasives with a FA/O alkaline cleaner.Based on the experiment results,it is concluded that both the FA/OII chelating and non-ionic surfactant could benefit the removal of colloidal silica abrasives.When the concentration of FA/OII chelating agent and FA/O non-ionic surfactant reached the optima value,it was demonstrated that silica abrasives could be removed efficiently by this novel cleaning solution.

• 出版日期2015-10-15
• 单位河北工业大学