Application of through silicon via technology for in situ temperature monitoring on thermal interfaces

作者：Fu, Yifeng^*; Wang, Teng; Jonsson, Ove; Liu, Johan

来源：Journal of Micromechanics and Microengineering, 2010, 20(2): 025027.

DOI：10.1088/0960-1317/20/2/025027

• THIN-FILM

In this paper, a series of micro-machining processes have been developed to fabricate a test platform with the ability of in situ temperature monitoring on thermal interface behaviour. Through silicon vias (TSVs) with an aspect ratio up to 13 using Cu as a conductor have been applied to connect an array of platinum-based temperature sensors directly deposited on the thermal interfaces to be measured. The sensors are subsequently calibrated by an industry standard resistance temperature detector. Results show that the temperature sensors function normally in a temperature range up to 250 degrees C. This demonstrates the successful deposition of temperature-sensing materials and their good connection to the TSVs. The realization of direct precise temperature measurement on the thermal interface of this test platform enables thermal characterization with a high accuracy.

• 出版日期2010-2
• 单位上海大学