NUMERICAL ANALYSIS OF THERMAL STRESSES IN CARBON FILMS OBTAINED BY THE RF PECVD METHOD ON THE SURFACE OF A CANNULATED SCREW

作者：Sawicki J^*; Dudek M; Kaczmarek L; Wiecek B; Swiatczak T; Olbrycht R

来源：Archives of Metallurgy and Materials, 2013, 58(1): 77-81.

DOI：10.2478/v10172-012-0154-9

• RF PECVD
• thermography
• carbon films
• residual stresses
• finite element modeling

For many years, research on carbon films has been stimulated by the need to simultaneously optimize their biological and mechanical properties and by the challenges related to their deposition on medical implants. The residual mechanical stress occurring inside deposited films is the most important mechanical parameter which leads to the total destruction of these films by cracking and peeling. In the present work, we systematically studied the effect of ion bombardment during the process of radio frequency plasma enhanced chemical vapor deposition (RF PECVD) by monitoring the temperature distribution on a cannulated screw using the infrared technique. The obtained experimental and finite element modeling (FEM) results show that stresses in carbon films deposited on a cannulated screw are quite inhomogeneous and depend on the geometry of the sample and the relative position of the studied contact area between the substrate/film interface and the surface of the film. Keywords: RF PECVD, thermography, carbon films, residual stresses, finite element modeling

• 出版日期2013