Assembly and Electrical Characterization of Multiwall Carbon Nanotube Interconnects

作者：Close Gael F^*; Wong H S Philip

来源：IEEE Transactions on Nanotechnology, 2008, 7(5): 596-600.

DOI：10.1109/TNANO.2008.927373

• Carbon nanotube
• interconnects
• nanoelectronics
• nanofabrication

We demonstrate a general method to assemble and contact arrays of individual multiwall carbon nanotube (MWCNT) interconnects between electrodes in one batch. We have also collected about 200 resistance measurements to compare four different contact metals: Al, Au, Ti, and Pd. We have also measured the radio frequency characteristics of the assembled MWCNTs up to 15 GHz. High-resolution transmission electron microscopy analysis has been used to correlate the electrical and physical characteristics of the MWCNTs.

• 出版日期2008-9