Bonding Strength of the Sn-58Bi Jointed IC Card Component Bonded by Ultrasonic Energy

作者：Myung Woo Ram; Sung Yong Gue; Moon Jeonghoon^*; Jung Seung Boo^*

来源：Nanoscience and Nanotechnology Letters, 2017, 9(8): 1190-1194.

DOI：10.1166/nnl.2017.2468

• Ultrasonic Bonding
• Sn-58Bi Solder
• Finite Elements Method
• Push-Out Test

The ultrasonic bonding process was studied to join the IC card and PVC substrate with Sn-58Bi solder paste. The ultrasonic bonding technology became an attractive candidate in joining processes due to several advantages such as short bonding time, low bonding temperature, and environment-friendly process. The ultrasonic horn was fabricated according to the simulation result designed by finite elements method (FEM) analysis. The microstructure and mechanical properties of the IC chip bump and Cu pad bonded by ultrasonic bonding method were investigated as a function of bonding times and steps. The bonding strength was evaluated by push-out test. The bonding strength of the step bonding process was higher than that of the conventional bonding. The highest bonding strength, 18 kg/cm(2), was achieved at 2 steps bonding process for 1 s, and the bonding strength was decreased with increasing number of steps.

• 出版日期2017-8