Preparation and properties of thermally conductive polyimide/boron nitride composites

作者：Yang, Na; Xu, Chen; Hou, Jun; Yao, Yanmei; Zhang, Qingxin; Grami, Maryam E.; He, Lianqi; Wang, Nongyue; Qu, Xiongwei^*

来源：RSC Advances, 2016, 6(22): 18279-18287.

DOI：10.1039/c6ra01084a

• HEXAGONAL BORON-NITRIDE
• EPOXY COMPOSITES
• FILMS
• IMIDIZATION
• PERFORMANCE
• HYBRID
• MICRO
• OXIDE

Polyimide (PI) has been widely used as a preferred packaging matrix material due to its low dielectricity, outstanding insulation and excellent thermal stability. Hexagonal boron nitride (h-BN) microparticles were functionalized with a silane coupling agent, 3-glycidyloxypropyltrimethoxy silane (gamma-MPS), to improve the interface action with the PI matrix. The modified h-BN (m-BN) particles were used to fabricate the PI/m-BN composites with enhanced thermal conductivity by in situ polymerization. The Fourier transform infrared (FTIR) spectra, thermo-gravimetric analysis (TGA), transmission electron microscopy (TEM) and contact angle test proved that gamma-MPS coupling agent molecules had been chemically grafted onto the h-BN surface. In addition, the effects of the m-BN content on the thermal conductivity of PI/m-BN composites were investigated. The composite obtained with 40 wt% m-BN particle loading presented a thermal conductivity of 0.748 W m(-1) K-1, 4.6 times higher than that of pure PI. Meanwhile, the fabricated PI/m-BN composites retained excellent electrical insulation and thermal stability. The glass transition temperature values of the PI/m-BN composites decreased slightly while the storage modulus improved with the increase of the m-BN content. These results showed that PI/m-BN composites may offer new applications in the microelectronic industry because future substrate materials require effective heat dissipation.

• 出版日期2016
• 单位河北工业大学