Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates

作者：Chowdhury Tamjid; Casey Dedan P; Rohan James F^*

来源：Electrochemistry Communications, 2009, 11(6): 1203-1206.

DOI：10.1016/j.elecom.2009.04.003

• Templates
• AAO
• Copper
• Electrodeposition
• Nanotubes
• Additives

Anodised aluminium oxide (AAO) templates have been utilised to investigate Cu deposition from a typical sulphate plating bath. The influence of the common additives poly ethylene glycol (PEG), chloride ion (Cl(-)) and Bis-(sodium sulphopropyl)-disulphide (SPS) on the deposition process has been analysed. The growth of Cu wires or nanotubes (with tube walls of 40-70 nm) is significantly influenced by the action of the additives. In the presence of either Cl(-) or SPS solid wire growth is observed, however, when PEG is added with Cl(-) the growth of ordered Cu nanotubes is observed. SPS added to a bath containing Cl(-) and PEG restores the growth of wires.

• 出版日期2009-6