Numerical analysis of heat transfer in a manifold microchannel heat sink with high efficient copper heat spreader

作者：Wang, Y^*; Ding, G F

来源：Microsystem Technologies, 2008, 14(3): 389-395.

DOI：10.1007/s00542-007-0455-5

• Copper heat spreader
• Microchannel heat sink
• Series analysis
• Transverse channel arrays

A manifold microchannel heat sink integrated with a high efficient copper heat spreader is presented. A series analysis of three-dimensional fluid flow and heat transfer performance in this microchannel heat sink and conventional structure are performed by CFX commercial software package. The temperature difference along the flow direction in the new microchannel heat sink is less than that of the conventional microchannel heat sink due to effect of the transverse channel arrays. The maximum heat flux input of the new microchannel heat sink increases 75% more than the conventional structure with the flow rate of 1 m/s. The new design has better heat transfer characteristics than conventional one for the full range of flow rates considered.

• 出版日期2008-3
• 单位上海交通大学