Development of Capacitive-Type MEMS Microphone with CMOS Amplifying Chip

作者：Lee Young Hwa; Jung Youngdo; Kwak Jun Hyuk; Hur Shin^*

来源：International Journal of Precision Engineering and Manufacturing, 2014, 15(7): 1423-1427.

DOI：10.1007/s12541-014-0486-7

• MEMS microphone
• Low stressed SiNx
• DRIE
• CMOS amplifier

In this study, we reported the fabrication of a capacitive MEMS microphone packaged with an analog amplifying chip. The MEMS device and the amplifying chip were made using a micromachining technique and an IC Multi-Project Chip (MPC) service, respectively. The MEMS device consisted of a low stressed SiNx membrane that is sensitive to sound and the rigid Si back plate. The membrane and the back-plate parts fabricated separately on two wafers were bonded through a eutectic bonding process. Finally, the MEMS device and the amplifying chip were packaged on a single PCB for measuring The evaluation results of the packaged microphone devices showed similar characteristics compared to FEM simulation results. The sensitivity of the microphone was about -37.4 dB in audio frequency bandwidth.

• 出版日期2014-7