Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders

作者：Chen Xu; Zhou Jian^*; Xue Feng; Bai Jing; Yao Yao

来源：Journal of Electronic Materials, 2015, 44(2): 725-732.

DOI：10.1007/s11664-014-3537-z

• Lead-free solder
• Sn-Ag-Cu
• microstructure
• mechanical properties

The influences of minor alloying elements Co, Ni, and Nd on the microstructures and mechanical properties of Sn-0.1Ag-0.7Cu (SAC0107) solder were investigated. The results show that the microstructures of SAC0107 alloy mainly consisted of primary Sn-rich phases and eutectic phases composed of Ag3Sn and Cu6Sn5 phases dispersed in a Sn matrix. With Co or Ni additions, the amount of primary Sn-rich phase reduced and IMCs dispersed more uniformly in the Sn matrix. The elements of Co and Ni were concentrated in (Co (x) Cu1-x )(6)Sn-5 and (Ni (x) Cu1-x )(6)Sn-5 intermetallic compounds (IMCs), respectively, and they also entered the IMC layer between solder alloys and Cu substrate during soldering. Shear strength of the joints all increased by adding Co, Ni, and Nd elements. Different from the Co and Nd additions, the addition of the Ni element also markedly improved the tensile strength and elongation of SAC0107 alloys.

• 出版日期2015-2
• 单位东南大学