A Wafer-Level Vacuum Package Using Glass-Reflowed Silicon Through-Wafer Interconnection for Nano/Micro Devices

作者：Jin Joo Young; Yoo Seung Hyun; Yoo Byung Wook; Kim Yong Kweon^*

来源：Journal of Nanoscience and Nanotechnology, 2012, 12(7): 5252-5262.

DOI：10.1166/jnn.2012.6353

• Through Wafer Interconnects
• Silicon via
• Reflowed Glass
• Pirani Gauge
• Wafer-Level Packaging

We propose a vacuum wafer-level packaging (WLP) process using glass-reflowed silicon via for nano/micro devices (NMDs). A through-wafer interconnection (TWIn) substrate with silicon vias and reflowed glass is introduced to accomplish a vertical feed-through of device. NMDs are fabricated in the single crystal silicon (SCS) layer which is formed on the TWIn substrate by Au eutectic bonding including Cr adhesion layer. The WLPof the devices is achieved with the capping glass wafer anodically bonded to the SOS layer. In order to demonstrate the successful hermetic packaging, we fabricated the micro-Pirani gauge in the SOS layer, and packaged it in the wafer-level. The vacuum level inside the packaging was measured to be 3.1 Torr with +/- 0.12 Torr uncertainty, and the packaging leakage was not detected during 24 hour after the packaging.

• 出版日期2012-7