Microwave integrated circuits fabrication on alumina substrate using pattern up direct electroless nickel and immersion Au plating and study of its properties

作者：Sharma R K^*; Kaneriya R; Patel Sandeep; Bindal Arun; Pargaien K C

来源：Microelectronic Engineering, 2013, 108: 45-49.

DOI：10.1016/j.mee.2013.02.061

• Microwave integrated circuits (MICs)
• Electroless nickel (NiP) plating
• Immersion gold (Au)
• Pattern up plating
• Solderability
• Bondability

Electroless NiP plating followed by immersion gold for depositing directly conductive layers on pattern alumina substrate can be used in the fabrication of microwave integrated circuits (MICs), as alternatives to the pattern up plating for which pattern in thick resist is mandatory.
A complete procedure for the fabrication of microwave integrated circuits has been described for patterning alumina substrates and further some properties of the conductive patterns obtained in this manner have been investigated, like: the adhesion between the metallic pattern and substrate, solderability, bondability, geometrical & dimensional accuracies and microwave losses in microstrip configuration for a broadband power divider.

• 出版日期2013-8