Active-Transient Liquid Phase (A-TLP) Bonding of Pure Aluminum Matrix Composite Reinforced with Short Alumina Fiber Using Al-12Si-xTi Foils as Active Interlayer

作者：Zhang, Guifeng^*; Su, Wei; Suzumura, Akio

来源：Metallurgical and Materials Transactions B-Process Metallurgy and Materials Processing Science, 2016, 47(3): 2026-2039.

DOI：10.1007/s11663-015-0371-5

• FILLER METAL
• IN-SITU
• SICP/A356 COMPOSITES
• ULTRASONIC VIBRATION
• INTERFACE STRUCTURE
• AIDED INTERACTION
• MICROSTRUCTURE
• ALLOY
• MMC
• BEHAVIOR

To optimize both the interlayer composition design route and pressure for joining aluminum matrix composite reinforced with short alumina fiber (as-cast 30 vol pct Al2O3sf/Al), traditional transient liquid phase (TLP) bonding using Al-12Si and Cu interlayer and active-TLP (A-TLP) bonding using an active Ti-containing interlayer (Al-12Si-xTi, x = 0.1, 0.5, and 1 wt pct) under the same condition [883 K (610 A degrees C) x 30 minutes x 1 or 0.015 MPa in flowing argon] were compared in terms of interfacial wettability, bond seam microstructure, shear strength, and fracture path. It was found that not only the Ti content but also the pressure are critical factors affecting interfacial wettability and bond seam microstructure. The improvement in wettability by adding Ti as an active element were confirmed by reduction of expulsion of liquid interlayer, elimination of interfacial gap, higher shear strength and favorable fracture path (partially through bond seam and the composite). Because of the incubation period for wetting, reducing the pressure after melting of the interlayer could further increase joint shear strength by thickening the remaining bond seam of solid-solution matrix and decreasing fraction of the in situ newly formed Al-Si-Ti IMC phase (short bar shape) within the bond seam. The maximum shear strength of 88.6 MPa (99 pct of the as-cast composite) was obtained by adding trace Ti content (0.5 Ti wt pct) addition and using low pressure (0.015 MPa). The results showed that suitable combination of Ti content and pressure pattern is required for improving both wettability and bond seam microstructure.

• 出版日期2016-6
• 单位西安交通大学