Modeling of cylindrical pin-fin heat sinks for electronic packaging

作者：Khan Waqar Ahmed^*; Culharn J Richard; Yovanovich M Michael

来源：IEEE Transactions on Components and Packaging Technologies, 2008, 31(3): 536-545.

DOI：10.1109/TCAPT.2008.2002554

• heat transfer
• pin-fin heat sinks

Analytical models are developed for determining heat transfer from in-line and staggered pin-fin heat sinks used in electronic packaging applications. The heat transfer coefficient for the heat sink and the average temperature of the fluid inside the heat sink are obtained from an energy balance over a control volume. In addition, friction coefficient models for both arrangements are developed from published data. The effects of thermal conductivity on the thermal performance are also examined. All models can be applied over a wide range of heat sink parameters and are suitable for use in the design of pin-fin heat sinks. The present models are in good agreement for high Reynolds numbers with existing experimental/numerical data.

• 出版日期2008-9