Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders

作者：Xiao, Yong; Zhang, Yuanqi; Zhao, Kai; Li, Shan; Wang, Ling; Xiao, Jue; Liu, Li^*

来源：Ceramics International, 2017, 43(16): 14314-14320.

DOI：10.1016/j.ceramint.2017.07.185

• Alumina
• Ultrasonic vibration
• Ni-foam
• Sn-based solder
• Microstructure
• Mechanical properties

Ultrasound-assisted dipping was performed to fabricate a Sn coating layer on the Al2O3 ceramic, then the as coated Al2O3 ceramics were ultrasonically soldered with Ni-foam reinforced Sn and Sn-9Zn composite solders, respectively. Effects of ultrasonic soldering time on the microstructure and mechanical properties of joints were investigated. A pure Sn metallization layer which exhibited excellent metallurgic bonding with Al2O3 ceramic was fabricated by ultrasonic dipping for more than 40 s. For Al2O3 joints soldered with composite solders for 4 s, Ni skeletons distributed irregularly in the soldering-seam and some pores existed in the base solders. A thin Ni3Sn4 intermetallic compound (IMC) layer was formed at the Sn/Ni interface while no reaction phase was found at the Sn-9Zn/Ni interface. Increasing the ultrasonic soldering time to 12 s the Ni skeletons were compressed into a strip type. In the Al2O3/Ni-Sn/Al2O3 joint, the gaps among Ni skeletons were filled with Ni3Sn4 layers with some reaction cavities trapped in them. However, in the Al2O3/Ni-Sn9Zn/Al2O3 joint, the Ni skeletons gaps were mainly filled with (Ni,Zn)(3)Sn-4 bulks with some (Ni,Zn)(3)Sn-4 particles dispersed between them. The Al2O3/Ni-Sn9Zn/Al2O3 joint soldered for 12 s exhibited the highest shear strength of 53.45 MPa with the joint shear failed at the interface of filler metal layer and Al2O3 ceramic.

• 出版日期2017-11
• 单位武汉理工大学; 中国电器科学研究院有限公司