摘要

The physical properties, solderability, and creep-rupture life of the nanosized Ag particle-reinforced Sn-Pb composite solder were investigated. The experimental results indicate that the composite solder possesses good electrical conductivity as well as good solderability. Compared to the eutectic 63Sn-37Pb solder matrix, the nanosized Ag particle-reinforced composite solder improved the creep resistance and significantly enhanced the creep-rupture life of its solder joints. The fracture surface revealed a mixture of ductile and brittle fracture features.