Fabrication of Circuits on Flexible Substrates Using Conductive SU-8 for Sensing Applications

作者：Gerardo Carlos D^*; Cretu Edmond; Rohling Robert

来源：Sensors, 2017, 17(6): 1420.

DOI：10.3390/s17061420

• SU-8
• silver nanoparticles
• percolation threshold
• planar inductors
• passive filters
• interconnections

This article describes a new low-cost rapid microfabrication technology for high-density interconnects and passive devices on flexible substrates for sensing applications. Silver nanoparticles with an average size of 80 nm were used to create a conductive SU-8 mixture with a concentration of wt 25%. The patterned structures after hard baking have a sheet resistance of 11.17 Omega/square. This conductive SU-8 was used to pattern planar inductors, capacitors and interconnection lines on flexible Kapton film. The conductive SU-8 structures were used as a seed layer for a subsequent electroplating process to increase the conductivity of the devices. Examples of inductors, resistor-capacitor (RC) and inductor-capacitor (LC) circuits, interconnection lines and a near-field communication (NFC) antenna are presented as a demonstration. As an example of high-resolution miniaturization, we fabricated microinductors having line widths of 5 mu m. Mechanical bending tests were successful down to a 5 mm radius. To the best of the authors' knowledge, this is the first report of conductive SU-8 used to fabricate such planar devices and the first on flexible substrates. This is a proof of concept that this fabrication approach can be used as an alternative for microfabrication of planar passive devices on flexible substrates.

• 出版日期2017-6