Deep sub micrometer imaging of defects in copper pillars by X-ray tomography in a SEM

作者：Laloum D^*; Lorut F; Bertheau J; Audoit G; Bleuet P

来源：Micron, 2014, 58: 1-8.

DOI：10.1016/j.micron.2013.10.014

• Nanotomography
• X-ray
• 3D integration
• Copper pillar
• SEM
• Plasma FIB

The potential of X-ray nanotomography hosted in a SEM in presented in this paper. In order to improve the detail detectability of this system, which is directly related to the X-ray source size, thin metal layers have been studied and installed in the equipment. A 3D resolution pattern has been created in order to determine the smallest detectable features by this setup. This sample is a 25 mu m diameter copper pillar in which size-controlled holes have been milled using a plasma-focused ion beam. This pattern has then been scanned and the resulting 3D reconstruction demonstrates that the instrument is able to detect 500 nm diameter voids in a copper interconnection, as used in 3D integration.

• 出版日期2014-3
• 单位中国地震局