摘要

The effect of alloying P on oxidation behavior of the liquid Sn-8Zn-3Bi lead-free solder at 250°C was investigated by thermogravimetry experiment. The effect mechanism of P on the oxidation was discussed by scanning electronic microscopy (SEM) and auger electronic spectroscopy (AES) in experiments. Properties were compared between before after oxidation to explore the effect on solders'; other properties. The results indicate that P can improve the oxidation resistance of Sn-8Zn-3Bi obviously. P was oxidized which is prior to Zn. A oxide film consisting of P4O6 which was tend to volatilize formed on the surface of the solder. The over-all properties of the solder is best with the addition of 0.2wt.%P.

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