Active application of liquid etching agent improves adhesion of fibre posts to intraradicular dentine

作者:Scotti N*; Scansetti M; Rota R; Breschi L; Mazzoni A; Pasqualini D; Berutti E
来源:International Endodontic Journal, 2013, 46(11): 1039-1045.
DOI:10.1111/iej.12096

摘要

AimTo assess the effectiveness of an active application of liquid etching, compared with the standard gel formulation on smear layer removal from post space walls and push-out bond strength of luted fibre posts. %26lt;br%26gt;MethodologyHuman extracted teeth were collected and root filled. After post space preparation and cleaning with 10% ethylenediaminetetraacetic acid for 30s, teeth were assigned to four groups (n=11) according to etching procedure: (i) 37% phosphoric acid (H3PO4) gel; (ii) 37% H3PO4 liquid applied with an endodontic needle; (iii) 37% H3PO4 liquid applied with an Endovac; (iv) no etching procedure (control group). Three teeth per group were sectioned longitudinally and prepared for SEM examination to evaluate the presence of smear layer, debris, sealer/gutta-percha remnants, and the number of open tubules. Eight teeth per group were bonded with an etch-and-rinse adhesive, and fibre posts were luted with a resin-based cement. After cutting, specimens were prepared for a push-out test. Data were analysed by anova and post hoc tests (P%26lt;0.05). %26lt;br%26gt;ResultsImproved smear layer removal was obtained in Group 2, followed by Group 1, Group 3, and the control group (P%26lt;0.05). The mean values for the bond strength of the push-out test were: Group 1, 8.32.9MPa (coronal); 7.7 +/- 3.0 (middle); 3.3 +/- 1.9MPa (apical); Group 2, 7.8 +/- 2.1MPa (coronal); 6.9 +/- 3.9MPa (middle); 3.7 +/- 1.3MPa (apical); Group 3, 9.7 +/- 2.8MPa (coronal); 8.6 +/- 2.1MPa (middle); 6.9 +/- 2.3MPa (apical); and Group 4, 2.9 +/- 3.0MPa (coronal); 2.6 +/- 2.0MPa (middle); 1.1 +/- 2.0MPa (apical). %26lt;br%26gt;ConclusionsLiquid phosphoric acid applied with an endodontic needle yielded better canal wall smear layer removal and higher bond strength values when an etch-and-rinse system was used.

  • 出版日期2013-11