摘要

A new approach to interfacing fabric based wireless systems to traditional electronics circuitry is presented. Measurements show possible insertion losses of the connector to be < 1 dB up to frequencies of about 4 GHz when electroplating has been used to increase the hook and loop conductivities. This reported work points towards an interconnection system that is flexible and will allow the removal and replacement of conventional electronics connected to textile based systems.

  • 出版日期2013-10-24